| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing physical quantity sensor by which a physical quantity sensor chip is inclined by using a pair of metallic molds which integrally mold a lead frame provided with stages, frames, connectors, and projects; and a physical quantity sensor chip arranged on the stages and the injury of an elastically deformable sheet arranged on the internal surface of one of the metallic molds can be prevented. SOLUTION: The method of manufacturing physical quantity sensor includes a first clamping step of inclining the stages 7 and 9 by plastically deforming a connector 17a by pressing projecting pieces 19 and 21 by means of the internal surface F1 of one F, having the elastically deformable sheet on its internal surface F1 of the pair of metallic molds E and F by bringing the metallic molds E and F nearer to each other; and a second clamping step of fixing the lead frame in the metallic molds E and F by again bringing the molds E and F nearer to each other after the projecting pieces 19 and 21 are separated from the sheet S by separating the molds E and F from each other. In the first clamping step, the relative position of the metallic molds E and F when the molds E and F are brought nearer to each other is more separated from that of the molds E and F in the second clamping step. COPYRIGHT: (C)2006,JPO&NCIPI
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