SEMICONDUCTOR DEVICE, WAFER, AND DESIGNING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To extend a process margin of wiring for vibration accompanying scanning operation of a scanning type exposure device.

SOLUTION: In a semiconductor device, in a wiring layer where wiring width or wiring pitch of the semiconductor device having multilayer wiring is minimum, the lengthwise direction of the wiring is superior in the amount of data (wiring frequently used) is made the same as the scanning direction of the scanning type exposure device. In other words, the influence of a shift by vibration can be suppressed to the minimum by making the direction of the vibration the same as the lengthwise direction of a pattern.

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