| 摘要 |
PROBLEM TO BE SOLVED: To provide the forming method of a film pattern with which a laminated film or a connection film can easily and securely be obtained. SOLUTION: The forming method of the film pattern is provided with a bank forming process for forming a bank 35 on a substrate P in a structure where a level difference structure is arranged having a thin film 32 whose film thickness is relatively small, and a thick film 33 whose film thickness is large, and the thin film 32 is surrounded by the thick film 33; a first arranging process for arranging first function liquid 10 on a region surrounded by the thin film part 32; a drying process for drying arranged first function liquid 10, and obtaining a first function film 11; a thin film part removing process for selectively removing the thin film part 32 after the drying process; a second arranging process for arranging second function liquid on a region surrounded by a remaining bank after the thin film part 32 is removed; and a drying process for drying arranged second function liquid and obtaining a second function film. COPYRIGHT: (C)2006,JPO&NCIPI
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