发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce leak current generated when a depletion layer extends up to the chip end. SOLUTION: In an MOSFET 100, the trench 112 in a gate pad portion 50 and the outer circumferential portion 70 is deeper than the trench 111 in a cell region 60. A depletion layer extending in the direction of the gate pad portion 50 and the outer circumferential portion 70 from the cell region 60 is thereby interrupted through existence of the trench 112. The depletion layer is thereby terminated by the trench 112 not to reach the end of a semiconductor chip. Consequently, a leak current being generated from the cell region 60 in the end direction of the semiconductor chip is reduced. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100317(A) 申请公布日期 2006.04.13
申请号 JP20040281002 申请日期 2004.09.28
申请人 NEC ELECTRONICS CORP 发明人 OTANI KINYA
分类号 H01L29/78;H01L21/336;H01L27/04 主分类号 H01L29/78
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