| 摘要 |
<p>A package for flat, pliable objects, such as for wafer-shaped or film-shaped drug forms. The package has a carrier layer, a cover layer which is detachably connected to the carrier layer, and a first surface region wherein the carrier layer is not connected to the cover layer and is completely surrounded by a margin area. A cavity, enclosed on all sides, is formed for accommodating an object. The package has a second surface region wherein the carrier layer is not connected to the cover layer. At least one perforation line extends at least partially within the second surface region, and is provided both in the carrier layer and in the cover layer. Severing the perforation line forms a free edge of the cover layer which serves as a gripping aid and enables manual removal of the cover layer from the carrier layer. The disclosure further covers a process for packaging flat, pliable objects by forming the above-described package.</p> |
