| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board with a resistive body by enhancing the accuracy of the resistive body at resistive body forming through the improvement of the shape of the resistive body, reducing variations in the resistance, and materializing application of the manufacturing method to inner layers of a multilayer board. SOLUTION: Electrodes and the resistive body are formed by patterning by utilizing the adhesion of an exfoliated film comprising a photosensitive adhesive film so as to exfoliate and remove a conductive resin layer and a resistive layer. COPYRIGHT: (C)2006,JPO&NCIPI
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