| 摘要 |
A semiconductor device includes a substrate, a plurality of bonding fingers formed on the surface of the substrate, and a semiconductor element arranged above the surface of the substrate and having a plurality of connection pads on a surface opposite to a surface facing the substrate. The plurality of connection pads have a connection pad group aligned in the vicinity of a side of the semiconductor element along the same. The plurality of bonding fingers have a bonding finger arranged outside sides adjacent to sides of the semiconductor element along which the connection pad group is arranged. The connection pad group has the connection pad electrically connected to the bonding finger by wire bonding. Therefore, a semiconductor device attaining improved degree of freedom in routing without lowering quality and efficient reduction in its outer dimension is obtained. |
