| 摘要 |
PROBLEM TO BE SOLVED: To provide a method suitable for manufacturing an electronic component equipped with an insulation film for surface protection having a sufficient thickness and a bump having a sufficient height, while suppressing the occurrence of open defects. SOLUTION: The method of manufacturing an electronic component comprises a process wherein a conduction linkage is formed on an electrode pad 12 inside the opening of an insulation film, on a substrate which is formed with the electrode pad 12 and the insulation film having the opening corresponding to the electrode pad 12; and a process wherein the bump 15 is formed on the conduction linkage so that it may be in direct contact with the conduction linkage and may be protruding from the opening. The process of forming the bump 15 comprises a process of forming a resin film 30 in layers on the insulation film, process of forming an opening 30a in the resin film 30 so that the conduction linkage may be exposed, process (a) of supplying molten solder 36 into the opening 30a of the resin film 30, process (b) of cooling the molten solder 36 to form the bump 15, and process (c) of separating the resin film 30 from the insulation film. COPYRIGHT: (C)2006,JPO&NCIPI
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