| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device of a lamp type or a chip type etc. having a structure wherein, even if an LED chip is for emitting blue or ultraviolet light, or the LED chip for emitting very large light intensity, or the light emitting device in which temperatures of leads etc. are apt to rise being mounted, a covering member covering the LED chip is hardly discolored, and the peeling of a lead or the deformation of the covering member hardly occurs due to heat. <P>SOLUTION: The covering member 2 is provided to cover at least the light emitting surface side of the light emitting device 1. The covering member 2 is formed by filling voids of a porous glass member 21 obtained by coagulating glass powder into a desired shape with a resin 22 such as silicone resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
