| 摘要 |
PROBLEM TO BE SOLVED: To suitably realize multi-pin bonding lands and a smaller pitch thereof in the manufacturing method of a wiring board wherein a conductor component is printed on a substrate and hardened to form a plurality of bonding lands. SOLUTION: In the manufacturing method of the wiring board 10 wherein the conductor component 18a is printed on a green sheet 11a as the substrate and hardened to form the plurality of bonding lands 18, the conductor component 18a is printed in the formation regions of individual bonding lands 18, and at the same time the conductor component 18a is printed so that the spaces between the formation regions are filled with the conductor component 18a, and the formation regions are continuously connected by the conductor component 18a between them. After this printed conductor component 18a is hardened, each portion of hardened conductor component 18a located between the formation regions is removed by burning it off with a laser. COPYRIGHT: (C)2006,JPO&NCIPI |
