发明名称 CASE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To improve the quality of sealing while holding a sealing state in a sealing process for sealing a miniaturized vibrator by thermal fusion. SOLUTION: An electronic component case realizes a sealed case by covering a case body for storing an electronic component with a cover body by fusion sealing, and forming a step shape on the center of the cover body so that the cover body is engaged with the case body. A sealing material consisting of alloy plating is applied to a range from the step of the cover body up to the peripheral end of the cover body. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100669(A) 申请公布日期 2006.04.13
申请号 JP20040286438 申请日期 2004.09.30
申请人 KYOCERA KINSEKI CORP 发明人 HONDA TERUMOTO;NITOBE TAKESHI
分类号 H01L23/02;H01L23/10;H03H9/02 主分类号 H01L23/02
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