| 摘要 |
A bonding structure comprising bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+sigma or more where 1.80<=X<=2.1, A is as defined above, and sigma denotes a variation for the bonding procedure.
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