| 摘要 |
A wave soldering apparatus includes a blowing device 12 for blowing inert gas 18 towards the solder wave 7 so as to ensure that it overflows out of the nozzle 4 in the correct direction, i.e. in a direction opposite to the direction of travel of the printed circuit board 6 being soldered. The wave soldering apparatus also comprises a solder bath 1, and a pump 3 for pumping solder 2 through the nozzle 4. Preferably one or more sides of the nozzle 4 is/are made of a wettable material 5, with the other side(s) being made of a non-wettable material, further ensuring that the solder wave 7 flows along the wettable material 5 in the correct direction. A wettable guiding strip (14, figure 4) may be mounted next to the nozzle 4 to perform the same function. The supply of inert gas 18 is preferably able to be switched on and off quickly, and a heating element (11, figure 2) is preferably used to heat the inert gas 18 to prevent forced cooling of the solder wave 7. |
