| 摘要 |
PROBLEM TO BE SOLVED: To provide the heat dissipation structure of a heating element by which heat transmitted to a lead terminal projecting from the package of a heating element can be efficiently dissipated. SOLUTION: The heat dissipation structure includes a heating element 100 of which the lead terminal 104 is projected from a package 102, and is also provided with a heat sink 110 and an insulating heat conducting material 112 which is interposed between the lead terminal 104 and the heat sink 110 and joined with them. Thus, heat generated in the heating element 100 and transmitted to the lead terminal 104 is led to the heat sink 110 via the insulating heat conducting material 112. COPYRIGHT: (C)2006,JPO&NCIPI
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