| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is formed of a semiconductor substrate composing an LSI etc., and elements of different modes each composed of a fine structure like an MEMS element, monolithically mounted on the substrate. SOLUTION: According to the semiconductor device, each MEMS element 106 is formed of a side wall frame 106a and a metallic ceiling wall 106d arranged on the same. On the semiconductor substrate 101, the side wall frame 106a is sealed by the ceiling wall 106d while securing a space therein. Then columnar metallic posts 109 are formed on respective electrode pads 103, and further the MEMS elements 106 and fixed elements 107 are covered by a resin insulation layer 108 having a sufficient thickness. The resin insulation layer 108 exhibits a flat upper surface with upper surfaces of the respective metallic posts 109 exposed therein, and therefore mounting thereof as a semiconductor component member is facilitated. COPYRIGHT: (C)2006,JPO&NCIPI
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