Mehrlagenleiterplatten und Multichipmodul-Substrate

摘要

Multilayer printed circuit boards and multi-chip modular substrates (I) comprise laminated composite(s) of high temp.-resistant plastic (II) and metallic strip conductors (III), in which the plastic (III) is provided with a thin coating of amorphous, hydrogen-contg. carbon (a-C:H) having a hardness gradient and a water permeation coefft. of less than 1.1 x 10<-13> m<2>/s. Also claimed is a process for the prodn. of (I) by forming a thin layer of a-C:H on the plastic (II) by HF plasma deposition from gaseous hydrocarbons.