| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact sucking device, not only surely sucking and holding a ring-shaped work, but also preventing suction failure, and deformation and breakage of a thin work. <P>SOLUTION: A porous body 8 is provided on the suction side flat surface 2b of a chuck body 2, and an inlet 21 to a negative pressure chamber 22 is provided extending over the whole of the periphery thereof. The compressed air is jetted from an air jet surface 8b of the porous body 8 to apply the floating force to a sucked face of a semiconductor chip. Simultaneously the air in the periphery of the inlet 21 is sucked to apply the sucking force to the outer peripheral part side of the chip. When the sucking force is applied on the outer peripheral part side of the chip, the outer peripheral part side serves as a sucked part, so that the chip can be surely sucked and held. Further, since the inlet 21 is disposed extending over the whole periphery of the air jet surface 8b, the sucking force is not concentrated on one point, thereby preventing sucking failure, and deformation and breakage of a thin chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
