发明名称 |
Conductive pad design modification for better wafer-pad contact |
摘要 |
An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
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申请公布号 |
US2006073768(A1) |
申请公布日期 |
2006.04.06 |
申请号 |
US20050243488 |
申请日期 |
2005.10.04 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
MAVLIEV RASHID A.;KARUPPIAH LAKSHMANAN |
分类号 |
B24B37/04;B24B37/22;B24B37/24 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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