| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method having less steps than a conventional method, and capable of easily forming a metal pattern on various kinds of base materials such as a substrate for an integrated circuit in a short time. <P>SOLUTION: A photosensitive resin composition is prepared, which contains (A) a mixture consisting of a hydrolysable silane compound, its hydrolysate, and condensation product thereof, (B) a photo acid generator, and (C) a compound having metal atoms capable of forming catalyst in electroless plating. The photosensitive resin composition is applied on a base material 1 to form a coating layer 2, and light is selectively irradiated on a part of the coating layer 2 to partially cure the coating layer 2. Thereafter, the coating layer 2 is developed, a non-cured portion is removed to obtain a cured resin 5 having a predetermined pattern shape. By bringing the cured resin into contact with electroless plating solution 6, a metal pattern 10 having a metal thin film layer 7 deposited on the surface of the cured resin 5 is obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
