发明名称 SEALING MATERIAL TABLET, METHOD OF MANUFACTURING THE TABLET, AND ELECTRONIC COMPONENT DEVICE
摘要 A method of manufacturing a sealing material tablet capable of reducing the adhesion of sealingly forming material onto the punching surface of a tablet forming machine, the sealing material tablet manufactured by the method, and an electronic component device having an element sealed by using the sealing material tablet, the method of manufacturing the sealing material tablet comprising the steps of feeding releasing agent molten in solvent onto the punching surface of the tablet forming machine, forming a releasing agent layer of more than 0.001 to less than 0.07 mum in thickness on the punching surface, and feeding the sealingly forming material into the tablet forming machine; the sealing material tablet manufactured by the method or having a contact angle ratio of 1.15 to less than 1.35; the electronic component device comprising the element sealed by using the sealing material tablet.
申请公布号 KR20060029703(A) 申请公布日期 2006.04.06
申请号 KR20067004110 申请日期 2006.02.28
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 KUBO KATSUMI;INAGAWA TAKASHI;TERADA HIROSHI;ONO AKIO;MASUBUCHI HIROSHI;YAMADA TATEO
分类号 B29B11/12;B29C33/56;B29C33/58;B29C33/64;H01L21/00;H01L21/56;H01L23/29 主分类号 B29B11/12
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