发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device that dispenses with an external voltage application device by generating a high voltage in a chip, forms a gate breakdown type electric anti-fuse with a gate insulating film thickness that is the same as that of a normal transistor, and mounts the gate breakdown type electric anti-fuse or a thin-film resistance fuse for avoiding an increase in cost by a prior art. <P>SOLUTION: The semiconductor integrated circuit device comprises at least one irreversible element F00 for causing an irreversible change from a non-continuity state to a continuity state or from a continuity state to a non-continuity state by applying a voltage; a plurality of dielectric capacitors C01, C02 and C03; a means SW1 for charging each of the dielectric capacitors; a means SW2 for connecting dielectric capacitors in a direction where each charge voltage of the dielectric capacitors is added; and a means SW3 for applying the added charge voltage to the irreversible element and causing the irreversible change in the irreversible element. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093468(A) 申请公布日期 2006.04.06
申请号 JP20040278303 申请日期 2004.09.24
申请人 FUJITSU LTD 发明人 WAKAYAMA SHIGETOSHI
分类号 H01L27/04;H01L21/82;H01L21/822;H01L21/8242;H01L27/10;H01L27/108 主分类号 H01L27/04
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