| 摘要 |
PROBLEM TO BE SOLVED: To provide an analysis method for a component mounting board capable of expecting reduction of calculation cost and improvement of analysis accuracy. SOLUTION: This method has a process (A) for generating a board laminating shell model of a multilayered wiring board, a process (B) for generating a component laminating shell model divided by an element dividing line based on a bonding position of a component to the surface of the multilayered wiring board, a process (C) for re-dividing the mounting position of a component of the board laminating shell model, and a process (D) for forming an analysis model by coupling a board neutral surface with a component neutral surface by a bonding element equivalent to a mounting condition of the component. In the method, calculation is performed by adding a boundary condition to the analysis model. COPYRIGHT: (C)2006,JPO&NCIPI |
