发明名称 THERMALLY CONDUCTIVE COMPOSITIONS AND METHODS OF MAKING THEREOF
摘要 A composition comprising at least one liquid metal having a melting point less than 35°C; at least one electrically insulating solid filler comprising thermally conducting materials; at least one resin is provided. The composition is both thermally conducting and electrically insulating and has utility in the preparation of electronic devices comprising heat generating and heat dissipating structures. In one instance a composition is provided which comprises a liquid metal selected from the group consisting of gallium, gallium alloys, and mixtures thereof, a boron nitride particulate filler, and a silicone resin, wherein said liquid metal and particulate filler are present in a volume ratio of about 1:0.4 to about 1: 10. A method of making and using such a composition is also provided.
申请公布号 WO2005096320(A3) 申请公布日期 2006.04.06
申请号 WO2005US10600 申请日期 2005.03.29
申请人 GENERAL ELECTRIC COMPANY;ZHONG, HONG;GOWDA, ARUN, VIRUPAKSHA;ESLER, DAVID, RICHARD;PAISNER, SARA, NAOMI 发明人 ZHONG, HONG;GOWDA, ARUN, VIRUPAKSHA;ESLER, DAVID, RICHARD;PAISNER, SARA, NAOMI
分类号 C08K3/08;H01B3/00;H01L23/373;H01L23/42 主分类号 C08K3/08
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