发明名称 PHOTOSENSITIVE COMPOSITION, AND PATTERN FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive-type photosensitive composition and a pattern forming method that uses the photosensitive composition which are used in a manufacturing process for a semiconductor of an IC and the like, a manufacturing process for a liquid crystal circuit board, a thermal head and the like and another photofabrication processes, wherein exposure latitude, exposure latitude stability, and sensitivity and dissolution contrast at EUV (extreme-ultra violet) exposure are improved. <P>SOLUTION: The photosensitive composition contains (A1) a compound generating a specified alkane sulfonic acid, by irradiation with activated rays or radiation and (A2) a compound generating a specified acid, by irradiation it with activated rays or radiation. The photosensitive composition is used in the pattern forming method. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006091421(A) 申请公布日期 2006.04.06
申请号 JP20040276641 申请日期 2004.09.24
申请人 FUJI PHOTO FILM CO LTD 发明人 KODAMA KUNIHIKO
分类号 G03F7/004;G03F7/038;G03F7/039;H01L21/027 主分类号 G03F7/004
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