发明名称 |
Thermally activated fluxes for no-flow underfill compositions, packages made therewith, and methods of assembling same |
摘要 |
An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the underfill composition. A method includes assembly of the underfill composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the underfill composition.
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申请公布号 |
US2006073344(A1) |
申请公布日期 |
2006.04.06 |
申请号 |
US20040954651 |
申请日期 |
2004.09.29 |
申请人 |
JAYARAMAN SAIKUMAR |
发明人 |
JAYARAMAN SAIKUMAR |
分类号 |
B32B27/38;C08L63/00;H01L21/48;H01L21/50 |
主分类号 |
B32B27/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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