| 摘要 |
The present invention provides a contact image capturing structure comprising a substrate having a circuit layer, a detect chip located on the substrate and electrically connected to the circuit layer, a frame located on the substrate and surrounding the detect chip, a cavity is formed between the frame and the detect chip, and a transparent layer located in the frame to cover the detect chip and the circuit layer. The transparent layer above the detect chip is flat and the transparent layer above the cavity is slanted. Hence, the present invention can greatly reduce volume of the chip packaging structure, since the conventional optical devices are no more required. In addition, with the directly contact detection, the detected images can be directly displayed.
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