Method for connecting an integrated circuit to a substrate and corresponding arrangement

摘要

An integrated circuit, in particular from a chip, a wafer or a hybrid, to a substrate. A package is provided for the integrated circuit, which has a connection side, on which there are provided a plurality of connection regions for connection to the substrate. A corresponding plurality of connection regions are provided on the substrate, and elevated contact regions are provided on the connection regions of the package and/or the connection regions of the substrate. The elevated contact regions include a first group of contact regions and a second group of contact regions. A connection of the package to the substrate is created via the elevated contact regions. The elevated contact regions configured such that the first group of contact regions form a rigid connection and the second group of contact regions form an elastic connection between the package and the substrate. The invention likewise provides a corresponding circuit arrangement.