| 摘要 |
PROBLEM TO BE SOLVED: To provide a hollow plastic package, its manufacturing method, and electronic apparatus using the package, capable of providing an enough space for installing a die electrode on the bottom of an internal space, and of simplifying a working process, shortening working time, and ensuring airtightness of the hollow plastic package. SOLUTION: The hollow plastic package 1 is resin molded in a state where first and second leads 31, 32 extending in inward and outward directions with respect to an internal space 11 capable of mounting a PD element therein are sandwiched between upper and lower molds, and the internal space is cap sealed with a transparent cover 13. As the hollow plastic package, the first and second leads are configured such that inside terminals 311, 321 face the internal space while an outside terminal 312 is exposed to the outside. An upper side resin 121 is molded at roots of outside terminals of the first and second leads such that it is protruded outwardly from a lower side resin 122 when viewed from a direction perpendicular to each lead in a state where a wire bonding surface 311a is turned upward. COPYRIGHT: (C)2006,JPO&NCIPI |
