发明名称 VERBINDUNGSMITTEL FÜR METALL ODER KERAMIK UND VERFAHREN ZUM VERBINDEN VON METALL- ODER KERAMIKGEGENSTÄNDEN UNTER VERWENDUNG DES VERBINDUNGSMITTELS
摘要 A bonding agent for metals or ceramics comprising 0.25 to 18.0% by weight of a powder of Mg and 25 to 50% by weight of a hydroxyl solvent, the balance of its composition being a powder of AlN. The bonding agent having the constituents stated above has a large amount of reaction heat generated by the reaction of its constituents. This reaction heat destroys thermally any strong oxide film existing on the surface of a base body or a part to be joined thereto, and forming a barrier layer hindering their bonding when the base body and the part to be joined thereto are of an aluminum alloy. <IMAGE>
申请公布号 DE60208591(D1) 申请公布日期 2006.03.30
申请号 DE2002608591 申请日期 2002.09.24
申请人 HONDA GIKEN KOGYO K.K., TOKIO/TOKYO 发明人 MASUDA, HONDA ENGINEERING CO.
分类号 C04B37/00;B23K35/00;B23K35/14;B23K35/24;B23K35/28;B23K35/32;B23K35/34;C04B37/02;C09J1/00 主分类号 C04B37/00
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