发明名称 |
VERBINDUNGSMITTEL FÜR METALL ODER KERAMIK UND VERFAHREN ZUM VERBINDEN VON METALL- ODER KERAMIKGEGENSTÄNDEN UNTER VERWENDUNG DES VERBINDUNGSMITTELS |
摘要 |
A bonding agent for metals or ceramics comprising 0.25 to 18.0% by weight of a powder of Mg and 25 to 50% by weight of a hydroxyl solvent, the balance of its composition being a powder of AlN. The bonding agent having the constituents stated above has a large amount of reaction heat generated by the reaction of its constituents. This reaction heat destroys thermally any strong oxide film existing on the surface of a base body or a part to be joined thereto, and forming a barrier layer hindering their bonding when the base body and the part to be joined thereto are of an aluminum alloy. <IMAGE> |
申请公布号 |
DE60208591(D1) |
申请公布日期 |
2006.03.30 |
申请号 |
DE2002608591 |
申请日期 |
2002.09.24 |
申请人 |
HONDA GIKEN KOGYO K.K., TOKIO/TOKYO |
发明人 |
MASUDA, HONDA ENGINEERING CO. |
分类号 |
C04B37/00;B23K35/00;B23K35/14;B23K35/24;B23K35/28;B23K35/32;B23K35/34;C04B37/02;C09J1/00 |
主分类号 |
C04B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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