| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board such that a void is unlikely to be left in an Sn-based high-temperature solder member, when the solder member is jointed. SOLUTION: In the wiring board 1, a metal terminal pad 17 has its top surface part made of an Au-plating layer 54 and also has an Ni-plating layer 53 right below the Au-plating layer 54 in contact with the Au-plating layer 54, and the thickness of the Au-plating layer 54 is set to≥0.2μm and≤0.7μm. The Sn-based high-temperature solder member 140 made of Sn alloy, whose liquid temperature is 200°C to 232°C is used while joined as a solder member to the metal terminal pad 17. COPYRIGHT: (C)2006,JPO&NCIPI
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