发明名称 |
Mikromechanisches Gehäuse |
摘要 |
A micromechanical enclosure suitable for micromechanical sensors, particularly acceleration sensors in the field of automotive vehicles, includes a micromechanical structure on a substrate, a conductor track layer connected to the micromechanical structure on the main surface of the substrate, a cover that covers a part of the main surface of the substrate, and a level compensation layer arranged next to the conductor track layer beneath the contact area during the manufacture of the wafer. A planarizing layer, which forms a level surface, may additionally be applied above this, to form a level area on the substrate which can easily be joined to a level area of the cover by means of a metallic wafer bond. This achieves small overall dimensions and avoids a glass frit bond. |
申请公布号 |
DE10035564(B4) |
申请公布日期 |
2006.03.30 |
申请号 |
DE2000135564 |
申请日期 |
2000.07.21 |
申请人 |
CONTI TEMIC MICROELECTRONIC GMBH |
发明人 |
ENGELHARDT, ALBERT;HARTMANN, BERNHARD;PRECHTEL, ULRICH;SEIDEL, HELMUT |
分类号 |
B81B7/00;B81B3/00;H01L23/04;H01L23/10 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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