| 摘要 |
The present invention provides a bonding apparatus in which solder is conveyed onto a predetermined electrode, and the solder is melted by irradiation of a laser beam and is bonded to the electrode and has an object to prevent the solder from adhering to a solder conveying system of the apparatus. To achieve the above object, in the bonding apparatus, a film having low wettability to the solder and having a predetermined thickness such as a DLC film is coated on a region and a neighborhood of a solder holding and conveying member, which is contacted with the solder.
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