发明名称 DIELECTRIC PRECURSOR SOLUTION, METAL COMPOSITE PARTICLE, AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a dielectric precursor solution and a conductive paste which contribute to multi-layering and high densification of electronic components or the like and contribute to cost reduction, and have little carbon remaining volume after calcination. SOLUTION: The dielectric precursor solution has a dielectric precursor substance which is constituted of a compound system composition containing a plurality of kinds of organic components, and this dielectric precursor solution and metal composite particles are dispersed in a solvent and a conductive paste 6 is obtained. When an electrode membrane is formed by calcination, a dielectric is formed simultaneously from a dielectric precursor compound 8. Since the dielectric precursor compound 8 is molecular size, the metal particles are sintered and a dense electrode membrane having high conductivity is formed, and sintering is suppressed by the dielectric formed simultaneously and heat shrinkage is prevented. With this metal composite particle powder provided, a user can form a conductive paste of desired performance, and by constituting the dielectric precursor substance by a compound system composition containing a plurality of kinds of organic components, reduction of the carbon remaining volume after calcination can be realized. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006086012(A) 申请公布日期 2006.03.30
申请号 JP20040269272 申请日期 2004.09.16
申请人 DAIKEN KAGAKU KOGYO KK;FUJI KAGAKU KK 发明人 KAMIYAMA RIYUUSUKE;HARADA AKIO;UCHIDA FUMIO;SHIMIZU CHIEMI
分类号 H01B1/00;C01G23/00;H01B1/22 主分类号 H01B1/00
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