| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus with good productivity which can mount components efficiently on two types of substrates by thermocompression bonding or the like. <P>SOLUTION: In the component mounting apparatus 1, a substrate transfer device 10 is arranged between an ACF pasting apparatus 61 and a thermocompression bonding apparatus 62. The substrate transfer device 10 comprises a first moving mechanism 11 for moving a substrate 51 to be pasted with an ACF together with a jig 41, a second moving mechanism 12 for moving the substrate 51 to be treated with thermocompression bonding together with the jig 41, and an transfer arm mechanism 15 which transfers the substrate 51 pasted with the ACF together with the jig 41 between the first moving mechanism 11 and the second moving mechanism 12. The transfer arm mechanism 15 includes transfer arms 21 and 31 which move along a transfer rail 16 without interfering each other, receives the jig 41 holding the substrate 51 from the first moving mechanism 11, transfers and delivers the jig 41 together with the substrate 51 to the second moving mechanism 12, and at the same time, receives a vacant jig 41 from the second moving mechanism 12 and transfers and delivers the jig 41 to the first moving mechanism 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
