发明名称 PLANARIZATION OF EPITAXIAL HETEROSTRUCTURES INCLUDING THERMAL TREATMENT
摘要 A method of planarization of an epitaxial heterostructure comprising at least a strain-relaxed buffer layer epitaxially grown on a substrate of a different material, said method comprising: - a step of thermal annealing the epitaxial heterostructure at a temperature of at least 900 °C for a period of at least 2 hours, and - a step of chemical-mechanical polishing the surface of the strain-relaxed buffer layer. This method provides a specific thermal treatment which allows, by improving the relaxation of the strain-relaxed buffer layer, to obtain a better quality of the surface planarization and to insure a stable material for further processing.
申请公布号 WO2006032298(A1) 申请公布日期 2006.03.30
申请号 WO2004EP11439 申请日期 2004.09.22
申请人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES;MARTINEZ, MURIEL;DAVAL, NICOLAS;RAYSSAC, OLIVIER;BLONDEAU, BERYL 发明人 MARTINEZ, MURIEL;DAVAL, NICOLAS;RAYSSAC, OLIVIER;BLONDEAU, BERYL
分类号 (IPC1-7):H01L21/20;H01L21/321;B24B37/04 主分类号 (IPC1-7):H01L21/20
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