发明名称 |
PLANARIZATION OF EPITAXIAL HETEROSTRUCTURES INCLUDING THERMAL TREATMENT |
摘要 |
A method of planarization of an epitaxial heterostructure comprising at least a strain-relaxed buffer layer epitaxially grown on a substrate of a different material, said method comprising: - a step of thermal annealing the epitaxial heterostructure at a temperature of at least 900 °C for a period of at least 2 hours, and - a step of chemical-mechanical polishing the surface of the strain-relaxed buffer layer. This method provides a specific thermal treatment which allows, by improving the relaxation of the strain-relaxed buffer layer, to obtain a better quality of the surface planarization and to insure a stable material for further processing. |
申请公布号 |
WO2006032298(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
WO2004EP11439 |
申请日期 |
2004.09.22 |
申请人 |
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES;MARTINEZ, MURIEL;DAVAL, NICOLAS;RAYSSAC, OLIVIER;BLONDEAU, BERYL |
发明人 |
MARTINEZ, MURIEL;DAVAL, NICOLAS;RAYSSAC, OLIVIER;BLONDEAU, BERYL |
分类号 |
(IPC1-7):H01L21/20;H01L21/321;B24B37/04 |
主分类号 |
(IPC1-7):H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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