发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus comprising a substrate support for making the adjustment of a blow-off nozzle upon assembly unnecessary and simplifying the assembling work. SOLUTION: In the substrate processing apparatus 1, a substrate W to be processed is placed on the substrate support 2, and a processing solution is dropped on the surface of the substrate while rotating the substrate support 2 to process the surface. The substrate support 2 comprises a circular deep-dish shaped base 3, a disk-shaped top 10 which is fitted into the upper opening of the base and has a reversed-trapezoidal longitudinal cross-section, and a hollow rotatable shaft 15 installed at the center of rotation of the base 3 or the top 10. A gas blow-off nozzle 14 comprising a plurality of slit-like grooves outwardly and radially extending from the hollow rotatable shaft 15 is formed in at least one surface selected from the contact surface 13 of the top 10, and the contact surface 5a of the upper opening of the base 3 which are brought into contact with each other by that fit. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006086384(A) 申请公布日期 2006.03.30
申请号 JP20040270578 申请日期 2004.09.16
申请人 SES CO LTD 发明人 IIDA YOSHIKAZU;FUSANO MASAYUKI;KOBAYASHI MAKOTO;SONETA SAKANOBU
分类号 H01L21/683;H01L21/304 主分类号 H01L21/683
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