Apparatus and method for splitting substrates

摘要

The invention provides an apparatus for splitting a substrate apart, the substrate comprising two adjoining wafers defining between them a cleavage plane, the apparatus being characterized in that it comprises: means for feeding splitter means with a plurality of substrates disposed in a substrate-storage direction; splitter means for splitting apart wafers of the substrates, the splitter means comprising moving jaws; and means for performing controlled displacement of certain substrate wafers after they have been split apart in a direction that is substantially parallel to the substrate-storage direction, whereby the apparatus is suitable for splitting apart the plurality of substrates. The invention also provides an associated splitting method.