发明名称 |
Polyimide film for flexible printed board and flexible printed board using the same |
摘要 |
The present invention provides a flexible printed circuit which is free from curl, torsion and warpage due to temperature change and excellent flexural endurance. By using polyimide film having an average coefficient of thermal expansion of 1.0x10<SUP>-5 </SUP>to 2.5x10<SUP>-5 </SUP>cm/cm/° C. in a temperature range of 100° C. to 200° C. and a stiffness value of 0.4 to 1.2 g/cm as the base film for the flexible printed circuit, a flexible printed circuit having excellent thermal dimensional stability and flexural endurance can be prepared.
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申请公布号 |
US7018704(B2) |
申请公布日期 |
2006.03.28 |
申请号 |
US20030471047 |
申请日期 |
2003.09.04 |
申请人 |
KANEKA CORPORATION |
发明人 |
KANESHIRO HISAYASU;AKAHORI KIYOKAZU |
分类号 |
B32B15/00;B32B7/02;C08G63/00;C08G73/10;H05K1/03 |
主分类号 |
B32B15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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