发明名称 |
Method of attaching non-adhesive thermal interface materials |
摘要 |
Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
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申请公布号 |
US7019977(B2) |
申请公布日期 |
2006.03.28 |
申请号 |
US20030740956 |
申请日期 |
2003.12.17 |
申请人 |
INTEL CORPORATION |
发明人 |
LEE SERI;YOU SEUNG M.;CHANG JAE W. |
分类号 |
H05K7/20;H01L23/31;H01L23/36;H01L23/42 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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