发明名称 Slot designs in wide metal lines
摘要 A method and structure for slots in wide lines to reduce stress. An example embodiment method and structure for is an interconnect structure comprising: interconnect comprising a wide line. The wide line has a first slot. The first slot is spaced a first distance from a via plug so that the first slot relieves stress on the wide line and the via plug. The via plug can contact the wide line from above or below. Another example embodiment is a dual damascene interconnect structure comprising: an dual damascene shaped interconnect comprising a via plug, a first slot and a wide line. The wide line has the first slot. The first slot is spaced a first distance from the via plug so that the first slot relieves stress on the wide line and the via plug.
申请公布号 SG120223(A1) 申请公布日期 2006.03.28
申请号 SG20050004059 申请日期 2005.06.23
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 LIM YEOW KHENG;ALEX SEE;LEE TAE JONG;DAVID VIGAR;HSIA LIANG CHOO;PEY KIN-LEONG
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