| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique for manufacturing a printed-wiring board excellent in an uniformity in film thickness of a dielectric layer and a positional accuracy of a capacitor circuit, which removes as much of an extra dielectric layer as possible, and to provide the printed-wiring board having the embedded capacitor circuit. <P>SOLUTION: The manufacturing method comprises the steps of using the capacitor-layer-forming material having the dielectric layer between a first conductive layer for forming an upper electrode and a second conductive layer for forming a lower electrode, forming a first insulating layer on the outer surface of the second conductive layer of the capacitor-layer-forming material, etching between the upper electrode part of the first conductive layer positioning at the outer layer and the unnecessary part in a thin slit shape, after that, simultaneously exfoliating the dielectric layer of the unnecessary part by exfoliating and removing the unnecesary part of the first conductive layer, and machining the printed-wiring board by leaving only the upper electrode part. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
