| 摘要 |
<P>PROBLEM TO BE SOLVED: To quickly and surely mount an interposer on an antenna-formed sheet. <P>SOLUTION: An interposer 20a, which comprises a first nonconductive sheet 11, an extended electrode 12 and an IC chip 20, is prepared. The interposer 20a is mounted on each antenna 24 of an antenna-formed sheet 25 provided with a plurality of antennas 24 on a second nonconductive sheet 21. The antenna-formed sheet 25 and the interposer 20a are pressed and sandwiched between a reception roller 40 and an ultrasonic roller 33. When an ultrasonic oscillation is given to the interposer 20a from the ultrasonic roller 33, the first nonconductive sheet 11 of the interposer 20a is removed, and the antennas 24 are connected to the extended electrode 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
