PACKAGING STRUCTURE OF DIELECTRIC RESONATOR, AND DIELECTRIC OSCILLATOR, LOW-NOISE DOWN CONVERTER, AND TRANSMITTER EQUIPPED WITH RESONATOR

摘要

PROBLEM TO BE SOLVED: To provide a packaging structure of a dielectric resonator capable of preventing an increase in production cost and stabilizing temperature characteristics of a resonance frequency for the dielectric resonator, and to provide a dielectric oscillator, a low-noise down converter, and a transmitter equipped with the dielectric resonator. SOLUTION: The packaging structure of the dielectric resonator comprises a substrate 101 and a dielectric resonator 110. A through hole 109 is formed in the substrate 101. The cross section of the through hole 109 in the packaging surface of the substrate 101 mounted with the dielectric resonator 110 is a part of a region where the dielectric resonator 110 is mounted. COPYRIGHT: (C)2006,JPO&NCIPI