| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that decreases heat dissipation at a bellows provided to its elevating/descending mechanism to suppress a temperature reduction, stably deposits and generates a thin film on a substrate even under the use of a raw material sensitive to temperature, and copes with small quantity and large variety production, and uses various kinds of raw materials. SOLUTION: The substrate processing apparatus includes: a processing vessel 10 for processing a substrate 12; a support base 11 for supporting the substrate in the processing vessel; a heater 11 for heating the substrate; an elevating/descending means 4 for elevating/descending the support base; the bellows 6 provided between the processing vessel and the elevating/descending means, in order to air-tightly seal the part of the processing vessel through which part of the support base is penetrated; a bellows heater provided to the bellows at the part of the elevating/descending means; and a sub-bellows heater provided on the way of the bellows. COPYRIGHT: (C)2006,JPO&NCIPI
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