| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal wiring of high reliability by totally removing a deposited polymer that occurs after dry-etching while suppressing erosion of the exposed part of the metal wiring. SOLUTION: A silicon substrate 100 provided with a partially exposed metal wiring is supplied with a cleaning liquid 123, and the surface of silicon substrate 100 is covered with the cleaning liquid 123. Then, supplying of cleaning liquid on the silicon substrate 100 is stopped, and at least a part of the cleaning liquid covering the surface of silicon substrate 100 is held on the silicon substrate 100, and then the cleaning liquid that covers the surface of silicon substrate 100 is removed. COPYRIGHT: (C)2006,JPO&NCIPI
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