| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tape ball grid array (TBGA) package accompanied by an EMI protection and a method for manufacturing this TBGA package. <P>SOLUTION: The TBGA package has a conductive support structure (a conductive reinforcement material) 106, an integrated circuit chip 102 installed on the conductive support structure 106, and a substrate 108 installed on a conductive support structure 106, wherein the substrate 108 includes patterned metal layers 122 and 124 electrically connected to the integrated circuit chip 102 and a dielectric layer 126, having a direct electrical connection (e.g., wire bonds 138, 140, 142, and 144) between the conductive support structure 106 and the patterned metal layers 122 and 124. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
