发明名称 |
SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of preventing a process liquid from flowing around the surface of a substrate to be processed and of easily maintaining the product quality of the substrate, and to provide a highly reliable semiconductor substrate, a semiconductor component, and a semiconductor device. SOLUTION: The substrate processing apparatus 100 for applying a process liquid to a substrate W has a substrate rotating part 101 for rotating the substrate W, and a shield 103 for shielding the substrate W from atmosphere. The substrate rotator 101 has a process liquid supplier 110 for supplying the process liquid to the surface facing the substrate rotator 101 of the substrate W, and a regulator 105 for regulating the relative motion of the substrate W with respect to the substrate rotator 101. The shield 103 has a gas supplier for discharging a gas between the substrate W and the shield 103, and a proximity for coming close to the entire periphery of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006080392(A) |
申请公布日期 |
2006.03.23 |
申请号 |
JP20040264581 |
申请日期 |
2004.09.10 |
申请人 |
SEIKO EPSON CORP;TOSHIBA CORP;DAINIPPON SCREEN MFG CO LTD |
发明人 |
NAKAJIMA TOSHIKI;MIYAZAKI KUNIHIRO;HIGUCHI TAKASHI;MATSUO HIROYUKI |
分类号 |
H01L21/306;H01L21/304;H01L21/683 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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