发明名称 METHOD AND EQUIPMENT FOR FORMING RESIN FILM
摘要 <p>A process of spreading a liquid-state material such as adhesive supplied on the inner circumference side between boards of an optical disk, etc. or a material supplied on the inner circumference side on the board by high-speed rotation and a process of spreading such material by low-speed rotation are alternately performed a plurality of times. While the material is being rotated at a low-speed, beam irradiation is shifted successively or continuously or intermittently from the inner circumference side to the outer circumference side, and the liquid-state material is successively semi-hardened or hardened from the inner circumference side. Thus the thickness of a resin film formed from the liquid-state material is decided stepwise from the inner circumference side to the outer circumference side.</p>
申请公布号 WO2006030494(A1) 申请公布日期 2006.03.23
申请号 WO2004JP13377 申请日期 2004.09.14
申请人 ORIGIN ELECTRIC COMPANY, LIMITED;KOBAYASHI, HIDEO;SUZUKI, TAKAYUKI;OZAWA, NAOTO 发明人 KOBAYASHI, HIDEO;SUZUKI, TAKAYUKI;OZAWA, NAOTO
分类号 (IPC1-7):B05D1/40;G11B7/26;B05D3/06 主分类号 (IPC1-7):B05D1/40
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