| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode pad with which connection of a burn-in application electrode pad and an electrode pad becomes easy at the time of burn-in and to suppress a terminal connection fault at the time of burn-in. SOLUTION: In a semiconductor element, the burn-in application electrode pads 2 used in burn-in are formed on a chip rear face and a plane inside a chip. Thus, limit of a pad pitch and a pad opening size is largely relieved in the electrode pads 2 formed on the chip rear face and the inner plane. Consequently, the electrode pad with which connection of the burn-in application electrode pad 2 and the electrode pad of a burn in board becomes easy is supplied and the terminal connection fault of burn-in can be suppressed. COPYRIGHT: (C)2006,JPO&NCIPI
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