FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING ELEMENT

摘要

A flip chip mounting method, which is applicable to the flip chip mounting of the next-generation LSI and is high in productivity and reliability, comprising the steps of supplying resin (13) containing solder powder and a convective additive (12) onto a wiring board (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connection terminals (21) into contact with the surface of resin (13), and heating the wiring board (10) to a solder powder melting temperature under this condition. The heating is conducted at a temperature higher than the boiling temperature of the convective additive (12) to allow the boiled convective additive (12) to flow throughout the resin (13). During this heating process, melted solder powder is self-assembled between the electrode terminal (11) of the wiring board (10) and the connection terminal (21) of the semiconductor chip (20) to thereby electrically connect the electrode terminal (11) with the connection terminal (21). Finally, the resin (13) is cured to fix the semiconductor chip (20) to the wiring board (10).